Polyimide resin
    RTM polyimide resin

    BH-RTM

    BH-RTM polyimide resin material is a polymer with a chain structure featuring imine and aromatic rings in its main chain. It exhibits a very low melt viscosity, with a viscosity of ≤1.0 Pa·s during melting and a maintenance time of ≥2 hours. The curing process is straightforward. When compounded with other materials, it demonstrates excellent rheological properties and high stability during the heating and curing process, without releasing small molecules that could damage the internal structure of the material. Its long-term use temperature can exceed 300°C, and its short-term use temperature can exceed 500°C.

    Features


    •The processing window time is long
    •It possesses excellent mechanical properties, including high bending strength, high modulus, and high compressive strength
    •High thermal oxidation stability
    •High dimensional stability
    •Chemical resistance, electrical resistance, wear resistance, and heat resistance
    •Low creep, low outgassing
    •low toxicity


    Usage


    •In the aerospace field, such as aircraft engine components, spacecraft covers, etc
    •The matrix materials of biomedical implants, such as artificial joints and dental implants
    •Medical protective equipment, such as gloves, goggles, etc
    •Wear-resistant pads, wear-resistant strips, and pipe clamps
    •Wear-resistant components in centrifugal pumps
    •Water supply pump for hydrocarbons and chemicals

    Typical performance


    Performance
    Value
    Unit
    Method
    Color
    Tawny
    /
    /
    Density
    1.42g/cm3GB/T 1033.1-2008
    Tensile strength
    ≥100MPaGB/T 1040.1-2008
    Elongation at break
    ≥6.0%GB/T 1040.1-2008
    Bending strength
    ≥150MPaGB/T 9341-2008
    Flexural modulus
    ≥2800GPaGB/T 9341-2008
    Notched impact strength
    ≥120kJ/m2GB/T 1043.1-2008
    Compressive strength
    ≥200MPaGBT1041-2008
    Rockwell hardness
    ≥90HREGB/T 3398.2-2008
    Water absorption
    0.24%GB/T 1462-2005
    Coefficient of thermal expansion(CTE)
    42(23~350℃)
    ppm/KGBT36800.2-2018
    Glass transition temperature(Tg)330

    ASTMD4065-12