Cold plate liquid cooling technology is one of the most widely used liquid cooling technologies. Its core is to closely fit a metal cold plate (usually made of copper or aluminum) with internal flow channels onto the surface of high-heat-generating components such as CPUs and GPUs. The cooling liquid circulates in the internal flow channels of the cold plate, indirectly contacting the electronic components and absorbing the heat generated by the components. It is suitable for upgrading existing air-cooled data centers or for scenarios where the heat dissipation requirements are gradually increasing. It is currently the technology route with the highest market share.
Its technical advantages include relatively low cost for retrofitting existing servers and computer rooms, high technical maturity, good compatibility, targeted cooling of key high-heat components, and the use of low-cost cooling fluid. It usually requires air cooling as an auxiliary cooling method (forming a hybrid air-liquid cooling mode).
In this liquid cooling technology, which is currently the most widely used, ASTEC polyimide foam material, with its differentiated characteristics such as high temperature resistance, flame retardancy, non-toxicity, ultra-low density and weight, and ease of processing, can serve as an air gap filling solution, effectively blocking airflow and reducing noise. It optimizes the utilization of cold air and the thermal exhaust of the air cooling system, enhancing energy efficiency and thermal management performance.
