Polyimide resin
    Thermosetting polyimide resin

    BH-P1-D1

    BH-PI-D1 polyimide resin is an unfilled base resin. BH-PI-D1 resin is primarily used for demanding applications that require high toughness, thermal stability, and dimensional stability, chemical resistance, and stable dielectric properties over a wide temperature range.

    Features


    •High purity
    •High thermal oxidation stability
    •High toughness
    •High modulus and surface hardness
    •High chemical resistance
    •High heat resistance
    •High wear resistance, low gas emission
    •low creep
    •The manufacturing cost is lower than that of ceramics



    Usage


    •Bearings, bushings, insulating parts, sealing parts, thrust washers, and wear-resistant rings
    •Wear-resistant pads, wear-resistant strips, and pipe clamps
    •Test socket and wafer guide rail
    •CMP retaining ring
    •Glass clamping technology
    •Wear-resistant components in centrifugal pumps

    •Water supply pump for hydrocarbons and chemicals
    		•Aircraft engine parts
    •Nuclear radiation environment components

    Typical performance


    Performance
    Value
    Unit
    Method
    Color
    Tawny
    /
    /
    Density
    		1.33g/cm3
    		GB/T 1033.1-2008
     Tensile strength
    		≥90
    		MPa
    		GB/T 1040.1-2008
    Elongation at break
    		≥15.0
    		%GB/T 1040.1-2008
    Bending strength
    		≥120
    		MPa
    		GB/T 9341-2008
    Flexural modulus
    		≥3
    		GPa
    		GB/T 9341-2008
    Impact strength of cantilever beam
    		≥90
    		J/m
    		GB/T 1043.1-2008
    Thermosetting polyimide resin

    BH-P1-D2

    BH-PI-D2 polyimide resin is an unfilled base resin. BH-PI-D2 offers high physical strength, elongation, and excellent electrical and thermal insulation properties. BH-PI-D2 is a high-performance polyimide that provides a wide range of temperature resistance, chemical resistance, mechanical toughness, self-lubrication, wear resistance, and insulation properties. BH-PI-D2 can provide long-term operating temperatures from low temperature to 300°C, excellent plasma resistance, and UL rating, while also exhibiting extremely low electrical conductivity and thermal conductivity.

    Features


    •It exhibits outstanding performance in both high and low temperature applications (long-term: -260℃~300℃; short-term: 350℃)
    •High purity
    •Extremely low electrical conductivity and thermal conductivity
    •High strength and elongation
    •low gas emission
    •Excellent wear resistance, extending service life

    Usage

    •Sealing and insulating parts
    •valve seat
    •shim
    •lift valve
    •Clamping ring
    •wafer clamping
    •Internal antenna and semiconductor chip bracket of mobile phone
    •hot runner
    •Hot glass industrial production
    		•aerospace
    •Nuclear radiation environment components

    Typical performance


    Performance
    Value
    Unit
    Method
    Color
    tawny
    /
    /
    Density
    		1.42g/cm3
    		GB/T 1033.1-2008
    Tensile strength
    		≥50
    		MPa
    		GB/T 1040.1-2008
    Elongation at break
    		≥6.0
    		%GB/T 1040.1-2008
    Bending strength
    		≥100
    		MPa
    		GB/T 9341-2008
    Flexural modulus
    		≥2500
    		GPa
    		GB/T 9341-2008
    Notched impact strength

    		≥50
    		kJ/m2
    		GB/T 1043.1-2008
    compressive strength

    		MPa
    		GBT1041-2008
    Rockwell hardness
    		≥90
    		HRE
    		GB/T 3398.2-2008
    water absorption
    		0.3
    		%GB/T 1462-2005
    coefficient of thermal expansion(CTE)
    54(23~350℃)

    		ppm/K
    		GBT36800.2-2018
    glass transition temperature(Tg)
    		386
    ℃

    		ASTMD4065-12